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Product System
- Micro Ball Attach and Reflow Automation
- Inner Layer Inline Automation
- Outer Layer Inline Automation
- Solder Mask Inline Automation
- Pretreatment, Lamination, LDI Inline Automation
- Surface Layer Inline Automation
- Core Layer Inline Automation
Micro Ball Attach and Reflow Automation
Micro Ball Attach and Reflow Automation
Specifications:
1）Reduce material waiting/idle time and improve efficiency.
2）Reduce handling of material, and improve handling risks and quality.
3）Processes of different clean room environment can be connected, improve process yield.
4）MES ready with PC communication, and CCTV monitoring.
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